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Seitenansicht 43
µ
PD70F3003A, 70F3025A, 70F3003A(A)
42
Data Sheet U13189EJ5V1DS
(3)
µ
PD70F3003AGC(A)-33-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
Soldering Method Soldering Conditions Recommended
Condition Symbol
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. IR35-103-2
(at 210°C or higher), Count: Two times or less, Exposure
limit: 3 days
Note
(after that, prebake at 125°C for 10 to 72
hours)
VPS Package peak temperature: 215°C, Time: 25 to 40 seconds VP15-103-2
(at 200°C or higher), Count: Two times or less, Exposure
limit: 3 days
Note
(after that, prebake at 125°C for 10 to 72
hours)
Partial heating Pin temperature: 300°C max., Time 3 seconds max.
(per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remark For soldering methods and conditions other than those recommended above, consult an NEC Electronics
sales representative.
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