Renesas Single-Chip Microcomputer M37900T2-RPD-E Technical Information Seite 6

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Contents
Chapter 1. Precautions for Safety ...........................................................................................7
1.1 Safety Symbols and Meanings ..............................................................................8
Warning for Installation ...................................................................................9
Warning for Use Environment.........................................................................9
Caution to Be Taken for Modifying This Product ...........................................9
Cautions to Be Taken for Handling This Product............................................9
Notes on Target System .................................................................................10
Note on Reset Input from the Target System ................................................10
Notes on Stack Area ......................................................................................10
Note on MCU Files ........................................................................................10
Notes on EMEM Dialog ................................................................................11
Note on Boot Mode........................................................................................11
Note on Breaks Used with Internal Resources ..............................................11
Note on Software Breaks ...............................................................................11
Note on Debug Monitor Area ........................................................................11
Note on Interface with the Target System .....................................................12
Notes on Service-Life of the MCU's Internal Flash ROM ............................12
Note on Debug Commands during STP/WIT Instruction .............................12
Notes on Disabling Watchdog Function ........................................................12
Note on Real-Time RAM Monitor ................................................................12
Note on Coverage Measurement....................................................................12
Note on Differences between Actual MCU and Emulator ............................13
Note on Switch Settings on the Pod Probe ....................................................13
Note on Synchronous Designed Target Systems ...........................................13
Chapter 2. Preparation ..........................................................................................................15
2.1 Terminology ........................................................................................................16
2.2 Package Components ..........................................................................................17
2.3 Other Tool Products Required for Development ................................................17
2.4 System Configuration..........................................................................................18
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