Renesas Single-Chip Microcomputer M37900T2-RPD-E Technical Information PDF herunterladen (Seite 17)

( 15 / 44 )

Chapter 2. Preparation

This chapter describes the package components, the system configuration and the preparation for using this product for the

first time.

2.1 Terminology ............................................................................................................................... 16

2.2 Package Components.................................................................................................................. 17

2.3 Other Tool Products Required for Development........................................................................ 17

2.4 System Configuration ................................................................................................................. 18

1 2 ... 12 13 14 15 16 17 18 19 20 21 22 ... 45 46

Keine Kommentare

Renesas Single-Chip Microcomputer M37900T2-RPD-E Technical Information Seite 17