Renesas Emulation Pod M306H2T-RPD-E Technical Information Seite 53

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Chapter 5. Specifications
This chapter describes specifications of this product.
5.1 Specifications .............................................................................................................................52
5.2 Operation Timing in Memory Expansion and Microprocessor Modes...................................... 53
(1) Separate Bus Timing............................................................................................................. 53
(2) Multiplex Bus Timing........................................................................................................... 55
(3) Timing Requirements ...........................................................................................................57
5.3 Connection Diagram................................................................................................................... 58
5.4 External Dimensions ..................................................................................................................60
(1) External Dimensions of the Emulation Pod.......................................................................... 60
(2) External Dimensions of the Converter Board M306H2T-PTC ............................................ 61
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