Renesas TFP-100G Technical Information Seite 22

  • Herunterladen
  • Zu meinen Handbüchern hinzufügen
  • Drucken
  • Seite
    / 32
  • Inhaltsverzeichnis
  • LESEZEICHEN
  • Bewertet. / 5. Basierend auf Kundenbewertungen
Seitenansicht 21
7
2.2.2 Soldering IC Socket
After fastening, solder the IC socket for a TFP-100G package to the user system.
CAUTION
Be sure to completely solder the leads so that the solder
slops gently over the leads and forms solder fillets. (Use
slightly more solder than the MCU.)
2.2.3 Inserting Cable Head
CAUTION
Check the location of pin 1 before inserting.
Align pin 1 on the IC socket for a TFP-100G package on the user system with pin 1 on the user
system interface cable head, and insert the user system interface cable head into the IC socket on
the user system, as shown in figure 4.
Seitenansicht 21
1 2 ... 17 18 19 20 21 22 23 24 25 26 27 ... 31 32

Kommentare zu diesen Handbüchern

Keine Kommentare