Renesas EDK3687 Technical Information Seite 1

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To our customers,
Old Company Name in Catalogs and Other Documents
On April 1
st
, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1
st
, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry
.
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Inhaltsverzeichnis

Seite 1 - To our customers

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology C

Seite 2

4.4. I2C EEPROM The board has been tested with an Atmel AT24C04AN-10SI-2.7 I2C EEPROM device (Not supplied). The device is configured to connect

Seite 3 - N-CHIP FLASH MICROCONTROLLER

5. BOARD OPTIONS The EDK has a number of configuration settings set by four jumpers CJ4 (A, B, C, D) and zero-ohm links. Common EDK functions ca

Seite 4 - Document Information

5.2. EDK OPTIONS – CJ4 The EDK options provide access to commonly used features of the EDK range. These jumpers must be fitted at all times to

Seite 5 - 1. TABLE OF CONTENTS

5.3. OPTION LINK SELECTION The following sections show the option links that apply to each peripheral device. The tables all use the same key of

Seite 6 - 2. START-UP INSTRUCTIONS

5.3.3. SPI – SERIAL PERIPHERAL INTERFACE The SPI interface is not directly compatible with the SCI interface on the device. Selection of the conn

Seite 7 - 3. EDK BOARD LAYOUT

6. MICROCONTROLLER HEADER CONNECTIONS The following table lists the connections to each or the headers on the board. 6.1. HEADER J1 J1 Pin No Fun

Seite 8 - 4. EDK OPERATION

7. CODE DEVELOPMENT 7.1. HMON 7.1.1. MODE SUPPORT The HMON library is built to support Normal Mode only. 7.1.2. BREAKPOINT SUPPORT The monitor ut

Seite 9 - 4.3. SPI EEPROM

7.1.4. MEMORY MAP On-Chip FLASHROMOn-Chip RAMInternal I/OREGISTERSOn-Chip RAMVectorsFDTInitFDTUserModeMicroKernelPHMONCHMONCUser_VectorsBHMONStac

Seite 10 - 4.6. LEDS

7.1.5. BAUD RATE SETTING HMON has initially set to connect at 115200Baud. Should the user wish to change this, the value for the BRR in HMONseria

Seite 11 - 5. BOARD OPTIONS

Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to chang

Seite 12 - 5.2. EDK OPTIONS – CJ4

EDK3687 USER MANUAL FOR H8/3687 ON-CHIP FLASH MICROCONTROLLER

Seite 13 - 5.3.2. LIN – LIN INTERFACE

Preface Cautions 1. This document may be, wholly or partially, subject to change without notice. 2. All rights reserved. No one is permitted

Seite 14 - 5.6. BOOT CONTROL

1. TABLE OF CONTENTS 1. TABLE OF CONTENTS ...

Seite 15 - 6.2. HEADER J2

2. START-UP INSTRUCTIONS 2.1. INSTALLING THE EVALUATION DEVELOPMENT KIT (EDK) Please refer to the quick start guide provided for initial instal

Seite 16 - 7. CODE DEVELOPMENT

3. EDK BOARD LAYOUT The diagram shows a general layout of the EDK board. 9-WayD-TypePowerRESETSwitchNMISwitchUser1 LEDUser2 LEDPower LEDFLASHProg

Seite 17 - 7.1.4. MEMORY MAP

4. EDK OPERATION 4.1. USER INTERFACE The EDK provides two buttons for influencing the operation of the board. The purpose of each button is clear

Seite 18 - 7.2. ADDITIONAL INFORMATION

4.2.2. CRYSTAL CHOICE The operating crystal frequency has been chosen to support the fastest operation with the fastest serial operating speeds.

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