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Chapter 2. Preparation

This chapter describes the package components, the system configuration and the preparation for using this product for the

first time.

2.1 Terminology ............................................................................................................................... 14

2.2 Package Components.................................................................................................................. 15

2.3 Other Tool Products Required for Development........................................................................ 15

2.4 Name of Each Part...................................................................................................................... 16

(1) System Configuration ........................................................................................................... 16

(2) Inside of the Emulation Pod.................................................................................................. 17

2.5 When Using the Emulator for the First Time ............................................................................. 18

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Renesas Single-Chip Microcomputer M37900T2-RPD-E Technical Information Seite 15