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Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Seitenansicht 0
1 2 3 4 5 6 ... 170 171

Inhaltsverzeichnis

Seite 1 - To all our customers

Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp.The semiconductor operati

Seite 2 - Cautions

2• Wait function in slave mode (I2C bus format)A wait request can be generated by driving the SCL pin low after data transfer, excludingacknowledgeme

Seite 3 - H8S/2128F-ZTAT™

9222.2.5 Flash Memory CharacteristicsTable 22.13 shows the flash memory characteristics.Table 22.13 Flash Memory CharacteristicsConditions (5 V versio

Seite 4

93Item Symbol Min Typ Max UnitTestConditionErase Wait time afterSWE-bit setting*1x 10——µsWait time afterESU-bit setting*1y 200 — — µsWait time afterE-

Seite 5

9422.2.6 Usage NoteThe F-ZTAT and mask ROM versions have been confirmed as fully meeting the reference valuesfor electrical characteristics shown in t

Seite 6

9522.3 Electrical Characteristics [H8S/2128S Series]22.3.1 Absolute Maximum RatingsTable 22.14 lists the absolute maximum ratings.Table 22.14 Absolute

Seite 7 - Contents

9622.3.2 DC CharacteristicsTable 22.15 lists the DC characteristics. Table 22.16 lists the permissible output currents.Table 22.15 DC Characteristics

Seite 8

97Item Symbol Min Typ Max Unit Test ConditionsThree-stateleakagecurrent(off state)Ports 1 to 6 ITSI — — 1.0 µA Vin = 0.5 toVCC – 0.5 VInputpull-upMO

Seite 9 - C Bus Interface [Option]

98*5 The upper limit of the port 6 applied voltage is VCC + 0.3 V when CIN input is notselected, and the lower of VCC + 0.3 V and AVCC + 0.3 V when CI

Seite 10

99Table 22.15 DC Characteristics (2)Conditions: VCC = 4.0 V to 5.5 V, AVCC*1 = 4.0 V to 5.5 V, VSS = AVSS*1 = 0 V,Ta = –20 to +75°C (regular specifica

Seite 11 - C Bus Interface

100Item Symbol Min Typ Max Unit Test ConditionsInput RES Iin — — 10.0 µA Vin = 0.5 toleakagecurrentSTBY, NMI, MD1,MD0— — 1.0 µAVCC – 0.5 VPort 7 — —

Seite 12

101An external pull-up resistor is necessary to provide high-level output from SCL0 andSDA0 (ICE = 1).In the H8S/2128S Series, P52/SCK0 and P47 (ICE =

Seite 13 - C bus interface

3øPSNoisecancelerNoisecancelerClockcontrolFormatless dedicatedclock (channel 0 only)Bus statedecisioncircuitArbitrationdecisioncircuitOutput datacontr

Seite 14 - 16.2 Register Descriptions

102Table 22.15 DC Characteristics (3)Conditions (Mask ROM version): VCC = 2.7 V to 3.6 V, AVCC*1 = 2.7 V to 3.6 V,VSS = AVSS*1 = 0 V, Ta = –20 to +75°

Seite 15

103Item Symbol Min Typ Max Unit Test ConditionsThree-stateleakagecurrent(off state)Ports 1 to 6 ITSI — — 1.0 µA Vin = 0.5 toVCC – 0.5 VInputpull-upM

Seite 16

104*5 The upper limit of the port 6 applied voltage is VCC + 0.3 V when CIN input is notselected, and the lower of VCC + 0.3 V and AVCC + 0.3 V when C

Seite 17

105Table 22.16 Permissible Output CurrentsConditions: VCC = 4.0 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C (regular specifications),Ta = –40 to +85°C (w

Seite 18

106Table 22.17 Bus Drive CharacteristicsConditions: VCC = 4.0 V to 5.5 V, VCC = 2.7 to 3.6 V (3 V version), VSS = 0 VApplicable Pins: SCL1, SCL0, SDA

Seite 19

107600 ΩThis chipPorts 1 to 3LEDFigure 22.26 LED Drive Circuit (Example)22.3.3 AC CharacteristicsFigure 22.3 shows the test conditions for the AC ch

Seite 20 - WAIT Description

108(1) Clock TimingTable 22.18 shows the clock timing. The clock timing specified here covers clock (ø) output andclock pulse generator (crystal) and

Seite 21

109tCHtcyctCftCLtCrøFigure 22.28 System Clock TimingtOSC1tOSC1EXTALVCCSTBYRESøtDEXTtDEXTFigure 22.29 Oscillation Settling TimingøNMIIRQi(i = 0, 1

Seite 22

110(2) Control Signal TimingTable 22.19 shows the control signal timing. The only external interrupts that can operate on thesubclock (ø = 32.768 kHz

Seite 23

111tRESWtRESSøtRESSRESFigure 22.31 Reset Input TimingtIRQSøtNMIStNMIHIRQEdge inputNMI tIRQStIRQHIRQi(i = 2 to 0)IRQLevel inputtNMIWtIRQWFigure 22.32

Seite 24

4SCL inSCL outSDA inSDA out(Slave 1)SCLSDASCL inSCL outSDA inSDA out(Slave 2)SCLSDASCL inSCL outSDA inSDA out(Master)This chipSCLSDAVccVCCSCLSDAFigure

Seite 25

112(3) Bus TimingTable 22.20 shows the bus timing. Operation in external expansion mode is not guaranteed whenoperating on the subclock (ø = 32.768 k

Seite 26

113Condition A Condition B Condition C20 MHz 16 MHz 10 MHzTestItem Symbol Min Max Min Max Min Max Unit ConditionsRead dataaccess time 3tACC3— 2.0 ×tcy

Seite 27

114tRSD2øT1tADAS*A15 to A0, IOS*Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.tASDRD(read)tCSDT2tAStAStAStAS

Seite 28

115tRSD2øT2AS*A15 to A0, IOS*tASDRD(read)T3tAStAStAHtAHtASDtACC4tRSD1tACC5tRDStRDHtWRD1tWRD2tWDStWSW2tWDHD7 to D0(read)WR(write)D7 to D0(write)T1tWDD

Seite 29

116øTWAS*A15 to A0, IOS*RD(read)T3D7 to D0(read)WR(write)D7 to D0(write)T2tWTST1tWTHtWTStWTHWAITNote: * AS and IOS are the same pin. The function is

Seite 30

117tRSD2øT1AS*A15 to A0, IOS*T2tAHtACC3tRDSD7 to D0(read)T2 or T3 tAST1tASDtASDtRDHtADRD(read)Note: * AS and IOS are the same pin. The function is se

Seite 31

118tRSD2øT1AS*A15 to A0, IOS*T1tACC1D7 to D0(read)T2 or T3 tRDHtADRD(read)tRDSNote: * AS and IOS are the same pin. The function is selected by the IO

Seite 32

119(4) Timing of On-Chip Supporting ModulesTables 22.21 and 22.22 show the on-chip supporting module timing. The only on-chip supportingmodules that

Seite 33

120Condition A Condition B Condition C20 MHz 16 MHz 10 MHzTestItem Symbol Min Max Min Max Min Max Unit ConditionsTMR Timer outputdelay timetTMOD— 50 —

Seite 34

121øPorts 1 to 7 (read)T2T1tPWDtPRHtPRSPorts 1 to 6(write)Figure 22.38 I/O Port Input/Output TimingøtFTIStFTODFTOA, FTOBFTIA, FTIB,FTIC, FTIDFigure

Seite 35

516.1.4 Register ConfigurationTable 16.2 summarizes the registers of the I2C bus interface.Table 16.2 Register ConfigurationChannel Name Abbreviation

Seite 36

122øTMO0, TMO1TMOXtTMODFigure 22.41 8-Bit Timer Output TimingøTMCI0, TMCI1TMIX, TMIYtTMCStTMCStTMCWHtTMCWLFigure 22.42 8-Bit Timer Clock Input Tim

Seite 37

123SCK0, SCK1tSCKWtSCKrtSCKftScycFigure 22.45 SCK Clock Input TimingTxD0, TxD1(transmit data)RxD0, RxD1(receive data)SCK0, SCK1tRXStRXHtTXDFigure 22

Seite 38 - 16.3 Operation

124Table 22.22 I2C Bus TimingConditions: VCC = 4.0 V to 5.5 V, VCC = 2.7 V to 3.6 V (3 V version), VSS = 0 V, ø = 5 MHz tomaximum operating frequency,

Seite 39

125SDA0,SDA1VILVIHtBUFP* P*S*tSTAHtSCLHtSrtSCLLtSCLtSftSDAHSr*tSDAStSTAStSPtSTOSNote: * S, P, and Sr indicate the following conditions.S:P: Sr: Start

Seite 40

12622.3.4 A/D Conversion CharacteristicsTables 22.23 and 22.24 list the A/D conversion characteristics.Table 22.23 A/D Conversion Characteristics(AN7

Seite 41

127Table 22.24 A/D Conversion Characteristics(CIN7 to CIN0 Input: 134/266-State Conversion)Condition A: VCC = 5.0 V ± 10%, AVCC = 5.0 V ± 10%VSS = AVS

Seite 42

12822.3.5 Usage Note(1) The F-ZTAT and mask ROM versions have been confirmed as fully meeting the referencevalues for electrical characteristics shown

Seite 43

129(3) Specification differences in internal I/O registersMask ROM version of H8S/2128S, H8S/2127S are different from the H8S/2128 Series andH8S/2124

Seite 44 - (MLS = ACKB = 0, WAIT = 1)

13022.4 Electrical Characteristics [H8S/2124 Series]22.4.1 Absolute Maximum RatingsTable 22.25 lists the absolute maximum ratings.Table 22.25 Absolute

Seite 45

13122.4.2 DC CharacteristicsTable 22.26 lists the DC characteristics. Table 22.27 lists the permissible output currents.Table 22.26 DC Characteristics

Seite 46

616.2 Register Descriptions16.2.1 I2C Bus Data Register (ICDR)BitInitial valueRead/Write7ICDR7—R/W6ICDR6—R/W5ICDR5—R/W4ICDR4—R/W3ICDR3—R/W0ICDR0—R/W2I

Seite 47

132Item Symbol Min Typ Max Unit Test ConditionsThree-stateleakagecurrent(off state)Ports 1 to 6 ITSI — — 1.0 µA Vin = 0.5 toVCC – 0.5 VInputpull-upM

Seite 48

133Table 22.26 DC Characteristics (2)Conditions: VCC = 4.0 V to 5.5 V, AVCC*1 = 4.0 V to 5.5 V, VSS = AVSS*1 = 0 V,Ta = –20 to +75°C (regular specific

Seite 49

134Item Symbol Min Typ Max Unit Test ConditionsThree-stateleakagecurrent(off state)Ports 1 to 6 ITSI — — 1.0 µA Vin = 0.5 toVCC – 0.5 VInputpull-upM

Seite 50

135Table 22.26 DC Characteristics (3)Conditions : VCC = 2.7 V to 5.5 V, AVCC*1 = 2.7 V to 5.5 V,VSS = AVSS*1 = 0 V, Ta = –20 to +75°CItem Symbol Min T

Seite 51

136Item Symbol Min Typ Max Unit Test ConditionsThree-stateleakagecurrent(off state)Ports 1 to 6 ITSI — — 1.0 µA Vin = 0.5 toVCC – 0.5 VInputpull-upM

Seite 52

137Table 22.27 Permissible Output CurrentsConditions: VCC = 4.0 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C (regular specifications),Ta = –40 to +85°C (w

Seite 53

1382 kΩThis chipPortDarlington pairFigure 22.50 Darlington Pair Drive Circuit (Example)600 ΩThis chipPorts 1 to 3LEDFigure 22.51 LED Drive Circuit

Seite 54

139(1) Clock TimingTable 22.28 shows the clock timing. The clock timing specified here covers clock (ø) output andclock pulse generator (crystal) and

Seite 55

140tCHtcyctCftCLtCrøFigure 22.53 System Clock TimingtOSC1tOSC1EXTALVCCSTBYRESøtDEXTtDEXTFigure 22.54 Oscillation Settling TimingøNMIIRQi(i = 0, 1

Seite 56

141(2) Control Signal TimingTable 22.29 shows the control signal timing. The only external interrupts that can operate on thesubclock (ø = 32.768 kHz

Seite 57

7ICDR is an 8-bit readable/writable register that is used as a transmit data register whentransmitting and a receive data register when receiving. ICD

Seite 58 - 16.4 Usage Notes

142tRESWtRESSøtRESSRESFigure 22.56 Reset Input TimingtIRQSøtNMIStNMIHIRQEdge inputNMI tIRQStIRQHIRQi(i = 2 to 0)IRQLevel inputtNMIWtIRQWFigure 22.57

Seite 59

143(3) Bus TimingTable 22.30 shows the bus timing. Operation in external expansion mode is not guaranteed whenoperating on the subclock (ø = 32.768 k

Seite 60 - Table 16.8 I

144Condition A Condition B Condition C20 MHz 16 MHz 10 MHzTestItem Symbol Min Max Min Max Min Max Unit ConditionsRead dataaccess time 3tACC3— 2.0 ×tcy

Seite 61

145tRSD2øT1tADAS*A15 to A0, IOS*Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.tASDRD(read)tCSDT2tAStAStAStAS

Seite 62

146tRSD2øT2AS*A15 to A0, IOS*tASDRD(read)T3tAStAStAHtAHtASDtACC4tRSD1tACC5tRDStRDHtWRD1tWRD2tWDStWSW2tWDHD7 to D0(read)WR(write)D7 to D0(write)T1tWDD

Seite 63 - Retransmission

147øTWAS*A15 to A0, IOS*RD(read)T3D7 to D0(read)WR(write)D7 to D0(write)T2tWTST1tWTHtWTStWTHWAITNote: * AS and IOS are the same pin. The function is

Seite 64

148tRSD2øT1AS*A15 to A0, IOS*T2tAHtACC3tRDSD7 to D0(read)T2 or T3 tAST1tASDtASDtRDHtADRD(read)Note: * AS and IOS are the same pin. The function is se

Seite 65 - Power supply 3 V version

149tRSD2øT1AS*A15 to A0, IOS*T1tACC1D7 to D0(read)T2 or T3 tRDHtADRD(read)tRDSNote: * AS and IOS are the same pin. The function is selected by the IO

Seite 66

150(4) Timing of On-Chip Supporting ModulesTable 22.31 shows the on-chip supporting module timing. The only on-chip supporting modulesthat can operat

Seite 67

151Condition A Condition B Condition C20 MHz 16 MHz 10 MHzTestItem Symbol Min Max Min Max Min Max Unit ConditionsTMR Timer outputdelay timetTMOD— 50 —

Seite 68

8TDRE Description0 The next transmit data is in ICDR (ICDRT), or transmission cannot (Initial value)be started[Clearing conditions]• When transmit d

Seite 69

152øPorts 1 to 7 (read)T2T1tPWDtPRHtPRSPorts 1 to 6(write)Figure 22.63 I/O Port Input/Output TimingøtFTIStFTODFTOA, FTOBFTIA, FTIB,FTIC, FTIDFigure

Seite 70

153øTMO0, TMO1tTMODFigure 22.66 8-Bit Timer Output TimingøTMCI0, TMCI1, TMIYtTMCStTMCStTMCWHtTMCWLFigure 22.67 8-Bit Timer Clock Input TimingøTMRI

Seite 71

154TxD0, TxD1(transmit data)RxD0, RxD1(receive data)SCK0, SCK1tRXStRXHtTXDFigure 22.70 SCI Input/Output Timing (Synchronous Mode)øADTRGtTRGSFigure 2

Seite 72

15522.4.4 A/D Conversion CharacteristicsTables 22.32 and 22.33 list the A/D conversion characteristics.Table 22.32 A/D Conversion Characteristics(AN7

Seite 73

156Table 22.33 A/D Conversion Characteristics(CIN7 to CIN0 Input: 134/266-State Conversion)Condition A: VCC = 5.0 V ± 10%, AVCC = 5.0 V ± 10%VSS = AVS

Seite 74

15722.4.5 Usage NoteThe specifications of the H8S/2128 F-ZTAT version and H8S/2124 Series mask ROM versiondiffer in terms of on-chip module functions

Seite 76

159Appendix F Product Code LineupTable F.1 H8S/2128 Series and H8S/2124 Series Product Code Lineup — Preliminary —Product TypeProductCode Mark Co

Seite 77

160Product TypeProductCode Mark CodePackage(HitachiPackageCode) NotesH8S/2128SSeriesH8S/2128S Mask ROMversionStandard product(5 V version,HD6432128S H

Seite 78

161Product TypeProductCode Mark CodePackage(HitachiPackageCode) NotesH8S/2124SeriesH8S/2122 Mask ROMversionStandard product(5 V version,HD6432122 HD64

Seite 79 - 22.2.3 AC Characteristics

916.2.2 Slave Address Register (SAR)BitInitial valueRead/Write7SVA60R/W6SVA50R/W5SVA40R/W4SVA30R/W3SVA20R/W0FS0R/W2SVA10R/W1SVA00R/WSAR is an 8-bit re

Seite 81

H8S/2128 Series, H8S/2124 Series, H8S/2128F-ZTAT™Hardware Manual (Supplement)Publication Date: 1st Edition, December 19973rd Edition, May 2002Publish

Seite 82

10DDCSWRBit 6SARBit 0SARXBit 0SW FS FSX Operating Mode000 I2C bus format• SAR and SARX slave addresses recognized1I2C bus format• SAR slave address

Seite 83

11Bit 0—Format Select X (FSX): Used together with the FS bit in SAR and the SW bit inDDCSWR to select the communication format.• I2C bus format: addr

Seite 84

Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products bett

Seite 85

12Bit 6—Wait Insertion Bit (WAIT): Selects whether to insert a wait between the transfer of dataand the acknowledge bit, in master mode with the I2C b

Seite 86

13Bits 5 to 3—Serial Clock Select (CKS2 to CKS0): These bits, together with the IICX1 (channel1) or IICX0 (channel 0) bit in the STCR register, select

Seite 87

14Bits 2 to 0—Bit Counter (BC2 to BC0): Bits BC2 to BC0 specify the number of bits to betransferred next. With the I2C bus format (when the FS bit in

Seite 88

15Bit 7—I2C Bus Interface Enable (ICE): Selects whether or not the I2C bus interface is to beused. When ICE is set to 1, port pins function as SCL and

Seite 89

16Bit 5 Bit 4MST TRS Operating Mode0 0 Slave receive mode (Initial value)1 Slave transmit mode1 0 Master receive mode1 Master transmit modeBit 5MST De

Seite 90

17Bit 3—Acknowledge Bit Judgement Selection (ACKE): Specifies whether the value of theacknowledge bit returned from the receiving device when using th

Seite 91

18Bit 2BBSY Description0 Bus is free[Clearing condition]When a stop condition is detected(Initial value)1 Bus is busy[Setting condition]When a start c

Seite 92

19Bit 1IRIC Description0 Waiting for transfer, or transfer in progress (Initial value)[Clearing conditions]1. When 0 is written in IRIC after reading

Seite 93

20When, with the I2C bus format selected, IRIC is set to 1 and an interrupt is generated, other flagsmust be checked in order to identify the source t

Seite 94

21Bit 0—Start Condition/Stop Condition Prohibit (SCP): Controls the issuing of start and stopconditions in master mode. To issue a start condition, wr

Seite 95

Hitachi 16-Bit Single-Chip MicrocomputerH8S/2128 Series, H8S/2124 SeriesH8S/2128F-ZTAT™Hardware Manual— Supplement —ADE-602-114BRev. 3.05/22/02Hitachi

Seite 96

22Bit 7ESTP Description0 No error stop condition[Clearing conditions]1. When 0 is written in ESTP after reading ESTP = 12. When the IRIC flag is clear

Seite 97 - Figure 22.24 I

23Bit 5IRTR Description0 Waiting for transfer, or transfer in progress[Clearing conditions]1. When 0 is written in IRTR after reading IRTR = 12. When

Seite 98

24AL is cleared by reading AL after it has been set to 1, then writing 0 in AL. In addition, AL isreset automatically by write access to ICDR in trans

Seite 99

25Bit 1—General Call Address Recognition Flag (ADZ): In I2C bus format slave receive mode,this flag is set to 1 if the first frame following a start c

Seite 100

2616.2.7 Serial/Timer Control Register (STCR)BitInitial valueRead/Write7—0R/W6IICX10R/W5IICX00R/W4IICE0R/W3FLSHE0R/W0ICKS00R/W2—0R/W1ICKS10R/WSTCR is

Seite 101

2716.2.8 DDC Switch Register (DDCSWR)BitInitial valueRead/WriteNotes: *1 Only 0 can be written, to clear the flag.*2 Always read as 1.7SWE0R/W6SW0R/W5

Seite 102

28Bits 5—DDC Mode Switch Interrupt Enable Bit (IE): Enables or disables an interrupt requestto the CPU when automatic format switching is executed for

Seite 103

29Bit 3 Bit 2 Bit 1 Bit 0CLR3 CLR2 CLR1 CLR0 Description0 0 — — Setting prohibited1 0 0 Setting prohibited1 IIC0 internal latch cleared1 0 IIC1 intern

Seite 104

30MSTPCRL Bit 3—Module Stop (MSTP3): Specifies IIC channel 1 module stop mode.MSTPCRLBit 3MSTP3 Description0 IIC channel 1 module stop mode is cleared

Seite 105

31S SLA R/W A DATA A A/A P1111n71 m(a) I2C bus format (FS = 0 or FSX = 0)(b) I2C bus format (start condition retransmission, FS = 0 or FSX = 0)n: t

Seite 106

Cautions1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’spatent, copyright, trademark, or other intellec

Seite 107

32Table 16.4 I2C Bus Data Format SymbolsLegendS Start condition. The master device drives SDA from high to low while SCL is highSLA Slave address, by

Seite 108

33The master device sequentially sends the transmit clock and the data written to ICDR with thetiming shown in figure 16.7. The selected slave device

Seite 109

34SDA(master output)SDA(slave output)21R/W436587129Abit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0bit 7 bit 6IRICIRTRICDRSCL(master output)Start cond

Seite 110

35(3) The IRIC flag is set to 1 at the fall of the 8th clock of a one-frame reception clock. At thispoint, if the IEIC bit of ICCR is set to 1, an int

Seite 111

369A Bit7Master receive modeMaster transmit modeSCL(master output)SDA(slave output)SDA(master output)IRICIRTRICDRUser processing [1] TRS cleared to 0W

Seite 112

3716.3.4 Slave Receive OperationIn slave receive mode, the master device outputs the transmit clock and transmit data, and theslave device returns an

Seite 113

38SDA(master output)SDA(slave output)21 214365879Bit 7 Bit 6 Bit 7 Bit 6Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0IRICICDRSICDRRRDRFSCL(master output)Start c

Seite 114

39SDA(master output)SDA(slave output)214365879879Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0Bit 1 Bit 0IRICICDRSICDRRRDRFSCL(master output)SCL(sla

Seite 115 - 22.3.3 AC Characteristics

40flags are set to 1 again. After clearing the IRIC flag to 0, write the next data to ICDR. Theslave device sequentially sends the data written into I

Seite 116

4116.3.6 IRIC Setting Timing and SCL ControlThe interrupt request flag (IRIC) is set at different times depending on the WAIT bit in ICMR, theFS bit i

Seite 117

February 2002Announcement of Changes to Hardware Manual ContentsThis is to announce that, with the addition of H8S/2128S and H8S/2127S products, a Sup

Seite 118

4216.3.7 Automatic Switching from Formatless Mode to I2C Bus FormatSetting the SW bit to 1 in DDCSWR enables formatless mode to be selected as the IIC

Seite 119

4316.3.8 Operation Using the DTCThe I2C bus format provides for selection of the slave device and transfer direction by means ofthe slave address and

Seite 120

4416.3.9 Noise CancelerThe logic levels at the SCL and SDA pins are routed through noise cancelers before being latchedinternally. Figure 16.13 shows

Seite 121

45StartInitializeRead BBSY in ICCRNoBBSY = 0?YesYesSet MST = 1 andTRS = 1 in ICCRWrite BBSY = 1and SCP = 0 in ICCRClear IRIC in ICCRRead IRIC in ICCRN

Seite 122

46Master receive operationRead ICDRClear IRIC in ICCRIRIC = 1?Clear IRIC in ICCRRead IRIC in ICCRIRIC = 1?Last receive ?YesYesNoNoNoYesYesYesNoYesRead

Seite 123

47StartInitializeSet MST = 0and TRS = 0 in ICCRSet ACKB = 0 in ICSRRead IRIC in ICCRIRIC = 1?YesNoClear IRIC in ICCRRead AAS and ADZ in ICSRAAS = 1and

Seite 124

48Slave transmit modeWrite transmit data in ICDRRead IRIC in ICCRIRIC = 1?Clear IRIC in ICCRClear IRIC in ICCRClear IRIC in ICCRRead ACKB in ICSRSet T

Seite 125

49• Internal latches for retaining the output state of the SCL and SDA pins (wait, clock, dataoutput, etc.)The following items are not initialized:•

Seite 126

5016.4 Usage Notes• In master mode, if an instruction to generate a start condition is immediately followed by aninstruction to generate a stop condi

Seite 127

51• The I2C bus interface specification for the SCL rise time tsr is under 1000 ns (300 ns for high-speed mode). In master mode, the I2C bus interfac

Seite 129

52Table 16.8 I2C Bus Timing (with Maximum Influence of tSr/tSf)Time Indication (at Maximum Transfer Rate) [ns]ItemtcycIndicationtSr/tSfInfluence(Max.)

Seite 130

53Time Indication (at Maximum Transfer Rate) [ns]ItemtcycIndicationtSr/tSfInfluence(Max.)I2C BusSpecifi-cation(Min.)ø =5 MHzø =8 MHzø =10 MHzø =16 MHz

Seite 131

54SDASCLInternal clockBBSY bitMaster receive modeICDR readingprohibitedBit 0A89Stop condition(a)Start conditionExecution of stop condition issuance in

Seite 132

55Read SCL pinWrite transmit data to ICDRClear IRIC in ICSRWrite BBSY = 1,SCP = 0 (ICSR)IRIC= 1 ?NoSCL= Low ?NoYesStart conditionissuance?No[1][2][3][

Seite 133 - Figure 22.48 I

56• Notes on I2C Bus Interface Stop Condition Instruction IssuanceIf the rise time of the 9th SCL clock exceeds the specification because the bus loa

Seite 134

57Section 22 Electrical Characteristics22.1 Voltage of Power Supply and Operating RangeThe power supply voltage and operating range (shaded part) fo

Seite 135

58Table 22.1 Power Supply Voltage and Operating Range (2) (Mask ROM Products)Product/Power supply 5 V version 4 V version 3 V versionHD6432128SHD64321

Seite 136

5922.2 Electrical Characteristics [H8S/2128 Series, H8S/2128 F-ZTAT]22.2.1 Absolute Maximum RatingsTable 22.2 lists the absolute maximum ratings.Table

Seite 137

6022.2.2 DC CharacteristicsTable 22.3 lists the DC characteristics. Table 22.4 lists the permissible output currents.Table 22.3 DC Characteristics (1)

Seite 138

61Item Symbol Min Typ Max Unit Test ConditionsThree-stateleakagecurrent(off state)Ports 1 to 6 ITSI — — 1.0 µA Vin = 0.5 toVCC – 0.5 VInputpull-upMO

Seite 139

iContentsSection 16 I2C Bus Interface [Option]... 116.1 Overview ...

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62*5 The upper limit of the port 6 applied voltage is VCC + 0.3 V when CIN input is notselected, and the lower of VCC + 0.3 V and AVCC + 0.3 V when CI

Seite 141

63Table 22.3 DC Characteristics (2)Conditions: VCC = 4.0 V to 5.5 V*8, AVCC*1 = 4.0 V to 5.5 V, VSS = AVSS*1 = 0 V,Ta = –20 to +75°C*8 (regular specif

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64Item Symbol Min Typ Max Unit Test ConditionsThree-stateleakagecurrent(off state)Ports 1 to 6 ITSI — — 1.0 µA Vin = 0.5 toVCC – 0.5 VInputpull-upMO

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65*6 Current dissipation values are for VIH min = VCC – 0.5 V and VIL max = 0.5 V with alloutput pins unloaded and the on-chip pull-up MOSs in the off

Seite 144

66Table 22.3 DC Characteristics (3)Conditions (Mask ROM version): VCC = 2.7 V to 5.5 V, AVCC*1 = 2.7 V to 5.5 V,VSS = AVSS*1 = 0 V, Ta = –20 to +75°C(

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67Item Symbol Min Typ Max Unit Test ConditionsThree-stateleakagecurrent(off state)Ports 1 to 6 ITSI — — 1.0 µA Vin = 0.5 toVCC – 0.5 VInputpull-upMO

Seite 146 - 22.4.3 AC Characteristics

68*5 The upper limit of the port 6 applied voltage is VCC + 0.3 V when CIN input is notselected, and the lower of VCC + 0.3 V and AVCC + 0.3 V when CI

Seite 147

69Table 22.4 Permissible Output CurrentsConditions: VCC = 4.0 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C (regular specifications),Ta = –40 to +85°C (wid

Seite 148

70Table 22.5 Bus Drive CharacteristicsConditions: VCC = 2.7 V to 5.5 V, VSS = 0 VApplicable Pins: SCL1, SCL0, SDA1, SDA0 (bus drive function selected

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71600 ΩThis chipPorts 1 to 3LEDFigure 22.2 LED Drive Circuit (Example)22.2.3 AC CharacteristicsFigure 22.3 shows the test conditions for the AC char

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ii22.3 Electrical Characteristics [H8S/2128S Series] ... 9522.3.1 Absolute Maximum R

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72(1) Clock TimingTable 22.6 shows the clock timing. The clock timing specified here covers clock (ø) output andclock pulse generator (crystal) and e

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73tCHtcyctCftCLtCrøFigure 22.4 System Clock TimingtOSC1tOSC1EXTALVCCSTBYRESøtDEXTtDEXTFigure 22.5 Oscillation Settling TimingøNMIIRQi(i = 0, 1, 2

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74(2) Control Signal TimingTable 22.7 shows the control signal timing. The only external interrupts that can operate on thesubclock (ø = 32.768 kHz)

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75tRESWtRESSøtRESSRESFigure 22.7 Reset Input TimingtIRQSøtNMIStNMIHIRQEdge inputNMI tIRQStIRQHIRQi(i = 2 to 0)IRQLevel inputtNMIWtIRQWFigure 22.8

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76(3) Bus TimingTable 22.8 shows the bus timing. Operation in external expansion mode is not guaranteed whenoperating on the subclock (ø = 32.768 kHz

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77Condition A Condition B Condition C20 MHz 16 MHz 10 MHzTestItem Symbol Min Max Min Max Min Max Unit ConditionsRead dataaccess time 3tACC3— 2.0 ×tcyc

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78tRSD2øT1tADAS*A15 to A0, IOS*Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.tASDRD(read)tCSDT2tAStAStAStASD

Seite 158

79tRSD2øT2AS*A15 to A0, IOS*tASDRD(read)T3tAStAStAHtAHtASDtACC4tRSD1tACC5tRDStRDHtWRD1tWRD2tWDStWSW2tWDHD7 to D0(read)WR(write)D7 to D0(write)T1tWDDt

Seite 159

80øTWAS*A15 to A0, IOS*RD(read)T3D7 to D0(read)WR(write)D7 to D0(write)T2tWTST1tWTHtWTStWTHWAITNote: * AS and IOS are the same pin. The function is

Seite 160

81tRSD2øT1AS*A15 to A0, IOS*T2tAHtACC3tRDSD7 to D0(read)T2 or T3 tAST1tASDtASDtRDHtADRD(read)Note: * AS and IOS are the same pin. The function is sel

Seite 161

1Section 16 I2C Bus Interface [Option]A two-channel I2C bus interface is available as an option in the H8S/2128 Series. The I2C businterface is not

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82tRSD2øT1AS*A15 to A0, IOS*T1tACC1D7 to D0(read)T2 or T3 tRDHtADRD(read)tRDSNote: * AS and IOS are the same pin. The function is selected by the IOS

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83(4) Timing of On-Chip Supporting ModulesTables 22.9 and 22.10 show the on-chip supporting module timing. The only on-chip supportingmodules that ca

Seite 164

84Condition A Condition B Condition C20 MHz 16 MHz 10 MHzTestItem Symbol Min Max Min Max Min Max Unit ConditionsTMR Timer outputdelay timetTMOD— 50 —

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85øPorts 1 to 7 (read)T2T1tPWDtPRHtPRSPorts 1 to 6(write)Figure 22.14 I/O Port Input/Output TimingøtFTIStFTODFTOA, FTOBFTIA, FTIB,FTIC, FTIDFigure 2

Seite 166

86øTMO0, TMO1TMOXtTMODFigure 22.17 8-Bit Timer Output TimingøTMCI0, TMCI1TMIX, TMIYtTMCStTMCStTMCWHtTMCWLFigure 22.18 8-Bit Timer Clock Input Timi

Seite 167

87SCK0, SCK1tSCKWtSCKrtSCKftScycFigure 22.21 SCK Clock Input TimingTxD0, TxD1(transmit data)RxD0, RxD1(receive data)SCK0, SCK1tRXStRXHtTXDFigure 22.

Seite 168

88Table 22.10 I2C Bus TimingConditions: VCC = 2.7 V to 5.5 V, VSS = 0 V, ø = 5 MHz to maximum operating frequency,Ta = –20 to +75°CItem Symbol Min Typ

Seite 169

89SDA0,SDA1VILVIHtBUFP* P*S*tSTAHtSCLHtSrtSCLLtSCLtSftSDAHSr*tSDAStSTAStSPtSTOSNote: * S, P, and Sr indicate the following conditions.S:P: Sr: Start

Seite 170

9022.2.4 A/D Conversion CharacteristicsTables 22.11 and 22.12 list the A/D conversion characteristics.Table 22.11 A/D Conversion Characteristics(AN7 t

Seite 171 - Hardware Manual (Supplement)

91Table 22.12 A/D Conversion Characteristics(CIN7 to CIN0 Input: 134/266-State Conversion)Condition A: VCC = 5.0 V ± 10%, AVCC = 5.0 V ± 10%VSS = AVSS

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